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详细介绍
NEW ELS-BODEN Electron Beam Lithography System
新型ELS-BODEN 电子束光刻系统
ELS Series
ELS-BODEN Ó
Fastest in the industry!
业内!
High speed scanning at 400MHz clock frequency for production
高速扫描400MHz频率生产
Key Product Features
关键产品特性Fastest in the industry!
• The industry's fastest 400 MHz high speed scanning
业界的400mhz高速扫描
High speed beam scanning, 4 times faster than our previous products.
高速光束扫描，比我们以前的产品快4倍。
High current and narrow beam pitch, which was not possible until now.
大电流和窄波束间距，这是不可能的，直到现在。
The new system achieves faster and higher quality writing. It is ideal for the MPWS (field-polymerized writing).
新系统实现更快和更高质量的刻写。它是MPWS(现场聚合刻写)的理想选择。
• Faster stage speed
阶段的速度更快
Redesigned the stage to meet the demands of production applications and achieved higher speeds.
重新设计了工作台，以满足生产应用的要求，并实现了更高的速度。
• Inherits traditional Elionix technology
继承了传统的Elionix技术
150kV/125kV if the ultra-fine patterns are most important.
150kV/125kV如果超细图案是最重要的。
100 kV for common system and wide variety of applications
100kv用于普通系统和广泛的应用
50 kV for high speed writing for the production.
50kv用于高速写作，用于生产。
It can meet user's several requirements.
能满足用户多方面的要求。
Specification 规格参数：
Emitter发射器 | ZrO/W thermal field emitter热场发射体 | |||
Acceleration Voltage 加速电压 | 50kV | 100kV | 125kV | 150kV |
Beam Current 电子束电流 | 1nA to 1µA | 20pA to 100nA | 5pA to 100nA | 5pA to 100nA |
Minimum Beam Diameter 最小电子束直径 | Φ5nm | Φ1.8nm | Φ1.7nm | Φ1.5nm |
Standard Field Size 标准写场直径 | 1000µm square | 1000µm square | 500µm square | 500µm square |
Min. / Max. Field size 最小/写场尺寸 | Min. 100µm square | |||
Scan Clock 扫描频率 | Max. 400MHz | |||
Minimam Shot Pitch 最小投射距离 | 0.2nm | |||
Maximum Specimen Size样品尺寸 | 8" wafer / 12" wafer | |||
Maximum Exposure Area 曝光面积 | 200mm × 200mm / 300mm × 300mm | |||
Loading System 加载系统 | Single cassette auto loader 单盒式自动装载机 多盒式自动装载机 12" FOUP 机器人装载机 带PEB的机器人装载机 可变晶片尺寸的机器人装载机
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Software 软件 | elms • Beam conditions •电子束条件 •接触的时间表 •图形数据转换器 •账户管理 •Python脚本
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